This aluminum (Al) sputtering target from Nanografi is a 99.999% pure disc measuring 1'' in size and 0.125'' in thickness, intended for depositing thin aluminum films by sputtering. In the process, material is eroded from the target and deposited onto a substrate such as a silicon wafer, giving a repeatable method that works for small R&D projects and can be scaled to production batches covering medium to large substrate areas.
Aluminum is a light, silvery white, soft and ductile metal known for its strength, durability and corrosion resistance, which comes from a very thin yet strong oxide film. It also offers high thermal and electrical conductivity.
The target has a particularly fine-grained microstructure, which supports uniform erosion and keeps particle formation low throughout sputtering. Because sputter deposition involves many process parameters, experienced users gain a high degree of control over film growth and microstructure.
- Thin film deposition of aluminum onto substrates such as silicon wafers.
- Sputter etching in semiconductor work where high etching anisotropy is needed and selectivity is not a concern.
- Material analysis by etching, for example in secondary ion mass spectrometry (SIMS) to determine composition and detect trace impurities.
- Research into space weathering processes that alter airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01AL02
- Material: Aluminum (Al)
- Size: 1''
- Thickness: 0.125''
- Microstructure: Fine-grained
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