Aluminum (Al) sputtering targets are solid metal target plates used as the source material in physical vapor deposition (PVD), specifically sputter deposition. In this process, energetic ions bombard the target surface and eject aluminum atoms that condense onto a substrate to form a thin metallic film. As a metallic target material, aluminum is widely used in thin-film research and development where a conductive, reflective, or protective layer is needed.
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- Thin-film electrodes and conductive layers for electronic and optoelectronic device research
- Reflective coatings for optical components and mirror research
- Metallization and interconnect layer studies in semiconductor process development
- Protective and decorative coating research on glass, polymer, and metal substrates
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