Aluminum (Al) sputtering targets are solid metal plates used as source material in physical vapor deposition (PVD), particularly magnetron sputtering. During the process, energetic ions bombard the target surface, ejecting aluminum atoms that condense onto a substrate to form a thin film. They belong to the metal sputtering target group used for thin-film research and development.
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- Conductive electrode and metallization layers in electronic device research
- Reflective and optical coatings for laboratory prototypes
- Adhesion or barrier layers in microfabrication studies
- Protective and functional thin films for surface engineering research
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