Aluminum (Al) sputtering targets are solid metal plates used as source material in physical vapor deposition (PVD). In sputtering, energetic ions strike the target surface and eject aluminum atoms, which then condense onto a substrate to form a thin film. Aluminum belongs to the group of lightweight, ductile, non-ferrous engineering metals, valued for its good electrical conductivity and reflectivity.
- Quantity: 1 piece
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- Metallization and interconnect layers in microelectronics and semiconductor research
- Reflective coatings for optical components and mirrors
- Protective and decorative thin films on glass, plastics, and metals
- Barrier and adhesion layers in multilayer thin-film device development
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