This aluminum (Al) sputtering target from Nanografi has a purity of 99.99%, a size of 4'' and a thickness of 0.125''. It serves as the source material in sputter deposition, where atoms are eroded from the target and laid down as a thin film on a substrate such as a silicon wafer. The process is repeatable, works on substrates of many shapes and sizes, and can move from small R&D runs to production batches covering medium to large areas.
Aluminum is a soft, ductile, silvery white metal valued for its low weight, strength, durability and corrosion resistance, which comes from a very thin yet tough oxide layer. It also conducts heat and electricity well.
The target has a notably fine-grained microstructure, giving uniform erosion and a low tendency toward particle formation over the course of sputtering. Because sputter deposition involves many process parameters, experienced users can closely control film growth and microstructure.
- Deposition of aluminum thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not critical.
- Materials analysis by etching away target material, as in secondary ion mass spectrometry (SIMS).
- Research and development work that can later be scaled to medium and large substrate production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01AL13
- Material: Aluminum (Al)
- Size: 4''
- Thickness: 0.125''
- Microstructure: Fine-grained
- Product code: NG0ST01AL13
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