Aluminum (Al) sputtering targets are solid metal sources used in physical vapor deposition (PVD) sputtering systems to deposit thin aluminum films onto substrates. They belong to the metallic sputtering target group. During sputtering, energetic ions erode the target surface, and the released atoms condense on a substrate to form a uniform thin layer. This product is categorized as a nanomaterial in the Nanografi range.
- 1 piece
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- Thin-film metallization studies for electronic and semiconductor device research
- Reflective and optical coating development for mirrors and optical components
- Conductive and barrier layer research in thin-film laboratories
- Surface coating and materials science experiments using PVD systems
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