This aluminum (Al) sputtering target is a high-purity 99.999% metal disc, 4'' in size and 0.125'' thick, used as the source material for depositing thin aluminum films by sputtering. During the process, material is eroded from the target and deposited onto a substrate such as a silicon wafer.
Sputter deposition can coat a broad range of substrate shapes and sizes, and it is repeatable, so a process developed in small R&D work can be scaled to production batches covering medium to large substrate areas. Its many process parameters give experienced users a high degree of control over film growth and microstructure.
Aluminum is a light, soft, ductile, silvery white metal known for its strength, durability and corrosion resistance, which comes from a very thin but strong oxide layer. It also has high thermal and electrical conductivity. Aluminum targets have a particularly fine-grained microstructure, which supports uniform erosion and low susceptibility to particle formation throughout sputtering.
- Thin film deposition of aluminum onto substrates such as silicon wafers.
- Sputter etching in semiconductor work where high etching anisotropy is needed and selectivity is not a concern.
- Materials analysis by etching away target material, as in secondary ion mass spectrometry (SIMS) to determine composition and detect trace impurities.
- Research related to space weathering, where sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01AL14
- Material: Aluminum (Al)
- Size: 4''
- Thickness: 0.125''
- Microstructure: Fine-grained
- Product code: NG0ST01AL14
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