Aluminum (Al) sputtering targets are solid metallic plates used as the source material in physical vapor deposition (PVD), most commonly magnetron sputtering, to deposit thin aluminum films onto substrates. Aluminum is a lightweight, ductile metal from the post-transition metals group, valued for its good electrical conductivity and high reflectivity.
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- Metallization and electrode layers in thin-film electronics research
- Reflective coatings for optical and mirror components
- Conductive and barrier layers in semiconductor device prototyping
- Protective and decorative coatings on glass, polymer, and metal substrates
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