An aluminum (Al) sputtering target is a solid metal source used in physical vapor deposition (PVD) to produce thin films. Aluminum belongs to the group of metallic sputtering targets, valued for its light weight and good electrical and reflective properties. It is commonly supplied as a disc or plate for use in sputtering systems. During sputtering, energetic ions eject atoms from the target surface, which then condense onto a substrate.
- 1 piece
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- Metallization layers and conductive contacts in thin-film electronic device research
- Reflective coatings for optical and mirror research
- Thin-film studies in materials science and surface engineering
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