This aluminum (Al) sputtering target from Nanografi has a purity of 99.99%, a size of 6'' and a thickness of 0.250''. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established, repeatable technique for coating substrates of many shapes and sizes, and it scales from small research projects to production batches covering medium to large substrate areas. Its many process parameters give experienced users considerable control over film growth and microstructure.
Aluminum is a light, soft, ductile, silvery white metal known for strength, durability and corrosion resistance, forming a very thin yet strong oxide layer and offering high thermal and electrical conductivity. Aluminum targets feature a particularly fine-grained microstructure, which supports uniform erosion and low susceptibility to particle formation during sputtering.
- Deposition of aluminum thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, for example in secondary ion mass spectrometry (SIMS) to determine composition and detect trace impurities.
- Research into space weathering processes that alter airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01AL20
- Material: Aluminum (Al)
- Size: 6''
- Thickness: 0.250''
- Product code: NG0ST01AL20
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