Aluminum (Al) sputtering targets are solid metallic plates used as the source material in physical vapor deposition (PVD) processes. Under vacuum, energetic ions bombard the target surface and eject aluminum atoms, which condense onto a substrate to form thin metallic films. Sputtering targets belong to the metallic thin-film source materials group and are widely used in laboratory and pilot-scale coating work.
- Quantity: 1 piece
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- Deposition of aluminum electrode and interconnect layers in microelectronics research
- Reflective and optical coating development
- Contact and metallization layer studies for photovoltaic devices
- Protective and functional thin-film research on glass, silicon, and polymer substrates
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