This aluminum (Al) sputtering target from Nanografi has a purity of 99.99%, a size of 8'' and a thickness of 0.125''. It serves as the source material for depositing thin aluminum films by sputtering, where material is eroded from the target and deposited onto a substrate such as a silicon wafer.
Sputter deposition works on substrates of many shapes and sizes, gives repeatable results and scales from small R&D work to production batches covering medium to large areas. Its many process parameters give experienced users close control over film growth and microstructure.
Aluminum is a light, silvery white, soft and ductile metal known for its strength, durability, corrosion resistance and high thermal and electrical conductivity, and it forms a very thin but strong oxide layer. These targets have a particularly fine-grained microstructure, which supports uniform erosion and low susceptibility to particle formation during sputtering.
- Thin film deposition of aluminum onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, such as secondary ion mass spectrometry (SIMS) for composition and trace impurity detection.
- Scalable coating processes from R&D projects to medium and large area production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01AL22
- Material: Aluminum (Al)
- Size: 8''
- Thickness: 0.125''
- Microstructure: Fine-grained
- Product code: NG0ST01AL22
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