This aluminum (Al) sputtering target from Nanografi has a purity of 99.99%, a size of 8'' and a thickness of 0.250''. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering can coat substrates of many shapes and sizes. The process is repeatable, works for small R&D projects and scales up to production batches covering medium to large substrate areas. Its many process parameters give experienced users close control over film growth and microstructure.
Aluminum is a silvery white, soft and ductile metal, valued for its low weight, strength, durability and corrosion resistance, which comes from a very thin but strong oxide layer. It also conducts heat and electricity well. These targets have a particularly fine-grained microstructure, which supports uniform erosion and reduces particle formation during sputtering.
- Thin film deposition of aluminum onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by sputtering, such as secondary ion mass spectroscopy (SIMS) for determining composition and detecting trace impurities.
- Research into space weathering processes affecting airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01AL24
- Material: Aluminum (Al)
- Size: 8''
- Thickness: 0.250''
- Microstructure: Fine-grained
- Product code: NG0ST01AL24
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