Aluminum oxide (Al2O3) sputtering targets are ceramic oxide source materials used in physical vapor deposition (PVD) to produce thin films. Aluminum oxide belongs to the technical ceramics and oxide material family, valued for its electrical insulation, chemical stability, and hardness. During sputtering, the target is bombarded with energetic ions, ejecting material that deposits onto a substrate.
- 1 piece
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- Dielectric and insulating layers in thin-film device research
- Protective and barrier coating studies
- Optical thin-film development
- Substrate passivation experiments in semiconductor R&D
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