This aluminum silicon (AlSi) sputtering target is a 3'' target with a thickness of 0.250'' and a purity of 99.999%. It serves as the source material in sputter deposition systems, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established way to coat substrates of many shapes and sizes with thin films. The process is repeatable, works for small research and development runs, and can be scaled to production batches covering medium to large substrate areas. Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate.
Because sputter deposition involves many adjustable parameters, it is a complex technique, but it gives experienced users considerable control over film growth and microstructure.
- Deposition of thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not critical.
- Material analysis by etching, such as secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Research related to space weathering, the sputtering process that alters airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01AL84
- Material: Aluminum Silicon (AlSi)
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01AL84
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