Aluminum silicon copper (AlSiCu) sputtering targets are solid source materials used in physical vapor deposition (PVD) to produce thin films. AlSiCu belongs to the aluminum-based metal alloy group, in which small silicon and copper additions are combined with aluminum to tailor the microstructure and electrical behavior of the deposited film.
- 1 piece
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- Metallization and interconnect thin-film research in microelectronics
- Thin-film deposition studies for electronic device prototyping
- Surface coating and adhesion studies on laboratory substrates
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