AlSiCu sputtering targets are solid alloy sources made from aluminum, silicon, and copper. In physical vapor deposition, the target is bombarded with energetic ions so that its atoms are ejected and deposited as a thin metallic film onto a substrate. As an aluminum-based metallic alloy target, it belongs to the category of materials used in thin film and coating research.
- Quantity: 1 piece
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- Metallization layer research for microelectronic interconnects
- Development of thin conductive films for electronic devices
- Deposition studies for protective and functional metallic coatings
- Materials research on aluminum-based thin film alloys
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