Aluminum Silicon Copper (AlSiCu) sputtering targets are solid source materials made from an aluminum-based alloy containing silicon and copper. They belong to the category of metallic alloy sputtering targets, which are used in physical vapor deposition (PVD). During sputtering, energetic ions bombard the target surface in a vacuum chamber, ejecting atoms that deposit onto a substrate as a thin metallic film.
- Quantity: 1 piece
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- Metallization layer research for thin-film electronic devices
- Conductor and interconnect film studies in microelectronics
- Metallic thin-film deposition for MEMS and sensor prototyping
- Surface and coating research in university and industrial laboratories
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