This aluminum silicon copper (AlSiCu) sputtering target is a 3'' disc, 0.250'' thick, supplied at 99.999% purity and sold as a single piece. It serves as the source material for depositing thin alloy films by sputtering, where material is eroded from the target and deposited onto a substrate such as a silicon wafer.
Sputter deposition works on substrates of many shapes and sizes, gives repeatable results and scales from small research projects up to production batches covering medium to large areas. Depending on process settings, reactions can take place at the target, in flight or on the substrate. This range of parameters gives experienced users fine control over film growth and microstructure.
Compared with aluminum silicon alloys, AlSiCu offers considerably higher strength. It also has good casting and machining behaviour, along with very good corrosion resistance and weldability. Because of its high purity, the alloy produces uniform films, which makes it well suited to semiconductor applications.
- Thin film deposition of AlSiCu alloy layers onto substrates such as silicon wafers.
- Semiconductor processes that require uniform, high-purity alloy films.
- Sputter etching where strong etching anisotropy is needed and selectivity is not critical.
- Materials analysis methods such as secondary ion mass spectrometry (SIMS), where sputtered atoms are measured to determine composition and trace impurities.
- Research on coatings for aerospace and transportation, where high-strength alloys are valued.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01AL76
- Material: Aluminum Silicon Copper (AlSiCu)
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01AL76
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