Aluminum Silicon Copper (AlSiCu) sputtering targets are solid source materials made from an aluminum-based alloy with silicon and copper additions. They belong to the metallic alloy group and are used in physical vapor deposition (PVD) to produce thin metallic films. In sputtering, ions bombard the target surface and eject atoms that condense onto a substrate, forming a uniform alloy film.
- Quantity: 1 piece
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- Metallization and interconnect layer research for microelectronic device prototypes
- Deposition of conductive electrode and contact films in thin-film studies
- Development of metal layers for MEMS and sensor fabrication
- Materials research on alloy thin-film microstructure and adhesion
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