Aluminum Silicon Copper (AlSiCu) sputtering targets are solid metallic alloy sources made from aluminum alloyed with silicon and copper. They belong to the metallic target class used in physical vapor deposition, where the target is bombarded by ions in a vacuum chamber, ejecting its atoms to form a thin film on a substrate.
- 1 piece
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- Interconnect and metallization layer research in microelectronics
- Deposition of conductive thin films for device prototyping
- Metallic coating studies on silicon, glass, and polymer substrates
- Process development in university and industrial thin-film laboratories
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