This bismuth (Bi) sputtering target from Nanografi has a purity of 99.999%, a size of 3'' and a thickness of 0.250''. It serves as the source material for depositing bismuth thin films onto substrates such as silicon wafers. Sputter deposition is repeatable, works with substrates of many shapes and sizes, and scales from small R&D work to production batches covering medium to large areas.
Bismuth is a silvery, brittle metal with a pinkish tinge that remains stable in air and water. Its films change from semi-metal to semiconductor at a critical thickness of roughly 30 nm, and bismuth is of interest for thermoelectric conversion, devices based on large magneto-resistance and reference electrodes for heavy metal detection.
When Bi coatings are grown by physical vapor deposition (PVD), their crystalline structure and morphology depend on parameters such as substrate temperature, target potential and ion beam energy. In DC sputtering, applying positive pulses between substrate and target can improve film density and mechanical properties.
- Deposition of bismuth thin films by RF or DC sputtering.
- Research on films that turn semiconducting near a thickness of about 30 nm.
- Fabrication of coatings for thermoelectric conversion and large magneto-resistance devices.
- Preparation of reference electrodes used to detect heavy metals.
- Sputter etching where high anisotropy is required and selectivity is not a concern.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01BI06
- Material: Bismuth (Bi)
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01BI06
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