This boron (B) sputtering target from Nanografi is an elastomer-bonded disc with 99.9% purity, a 2'' size and a 0.125'' thickness. It serves as the source material for depositing boron-based thin films by sputtering, a technique that works on substrates of many shapes and sizes and scales from small R&D runs to medium and large production batches.
Boron plays an important role in ion implantation and thin film work, including ion-beam doping of semiconductors, surface modification and the synthesis of boron-containing films such as boron nitride. Boron-based coatings can greatly improve surface properties, offering high hardness, toughness, corrosion resistance and wear resistance, in extreme cases approaching the properties of diamond.
Pure boron magnetron targets are mainly used in semiconductor doping and in reactive magnetron sputtering, where operating the target in a nitrogen atmosphere produces boron nitride films. Because sputter deposition involves many process parameters, it gives experienced users fine control over film growth and microstructure.
- Thin film deposition of boron onto substrates such as silicon wafers.
- Semiconductor doping using pure boron targets.
- Deposition of boron nitride films by reactive magnetron sputtering in a nitrogen atmosphere.
- Hard, wear- and corrosion-resistant boron-based coatings for surface improvement.
- Sputter etching where high etching anisotropy is required.
- Material analysis by sputtering, such as secondary ion mass spectrometry (SIMS).
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01BO07
- Material: Boron (B)
- Size: 2''
- Thickness: 0.125''
- Bonding: Elastomer
- Product code: NG0ST01BO07
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