This Boron (B) sputtering target from Nanografi is a 99.9% pure boron disc measuring 4'' with a thickness of 0.125'', supplied as a single piece. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film on a substrate such as a silicon wafer.
Boron plays an important role in ion implantation and thin film work. It is used for ion-beam doping of semiconductors, surface modification, and the synthesis of boron-containing films such as boron nitride. Boron-based coatings offer high hardness, toughness, corrosion resistance and wear resistance, in extreme cases approaching the properties of diamond.
Pure boron magnetron targets are mainly applied in semiconductor doping and in reactive magnetron sputtering, where the target is operated in a nitrogen atmosphere to grow boron nitride films. Sputtering is a repeatable process that scales from small R&D projects to production batches covering medium to large substrate areas.
- Thin film deposition onto substrates such as silicon wafers by sputtering.
- Semiconductor doping technology using pure boron magnetron targets.
- Deposition of boron nitride films by reactive magnetron sputtering in a nitrogen atmosphere.
- Production of hard, wear- and corrosion-resistant boron-based coatings.
- Sputter etching where high etching anisotropy is needed.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01BO05
- Material: Boron (B)
- Size: 4''
- Thickness: 0.125''
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