This boron nitride (BN) sputtering target is a 2'' disc, 0.125'' thick, with 99.5% purity. It serves as the source material for depositing BN thin films by sputtering, a physical vapor deposition (PVD) method in which material is eroded from the target and deposited onto a substrate such as a silicon wafer. Sputtering is repeatable and scales from small R&D work to production batches covering medium to large substrate areas.
Boron nitride is a refractory compound of boron and nitrogen that resists heat and chemical attack. Its hexagonal form (h-BN) is soft, lubricating and electrically insulating yet thermally conductive. The cubic form (c-BN) is second only to diamond in hardness and is more chemically stable than diamond against oxygen and ferrous materials at high temperatures.
Sputtering is favoured for BN coatings because it runs at lower coating temperatures, can produce thinner layers, and can coat sharp edges and complex shapes. The many process parameters give experienced users close control over film growth and microstructure.
- Thin film deposition of BN onto substrates such as silicon wafers.
- Hard c-BN coatings for cutting tools used in dry cutting, high speed machining and cutting of hard materials.
- Protective coatings exploiting the wear resistance and high-temperature chemical inertness of BN.
- Optical coatings and electrically insulating layers.
- Sputter etching where high etching anisotropy is required.
- Material analysis techniques such as secondary ion mass spectrometry (SIMS).
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.5% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01BO24
- Material: Boron Nitride (BN)
- Size: 2''
- Thickness: 0.125''
- Product code: NG0ST01BO24
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