This boron nitride (BN) sputtering target from Nanografi is a 99.5% purity disc measuring 2'' across and 0.250'' thick. It serves as the source material in sputter deposition, a physical vapor deposition (PVD) method in which material is eroded from the target and deposited as a thin film on a substrate such as a silicon wafer.
Boron nitride is a refractory compound of boron and nitrogen known for its resistance to heat and chemicals. Its hexagonal form (h-BN) is soft, lubricating and electrically insulating while conducting heat well. The cubic form (c-BN) is second only to diamond in hardness and offers better chemical stability against oxygen and ferrous materials at high temperatures.
Sputtering is a repeatable process that scales from small R&D work to production batches on medium to large substrates. Compared with other coating routes, it allows lower coating temperatures, thinner films and coverage of sharp edges and complex shapes, which makes it a practical way to grow BN coatings for cutting, protective, optical and insulating purposes.
- Thin film deposition of boron nitride onto substrates such as silicon wafers by sputtering.
- Research on cubic boron nitride coatings for cutting tools used in dry cutting, high speed machining and cutting of hard materials.
- Deposition of protective BN coatings with high hardness and wear resistance.
- Production of optical coatings and electrically insulating BN layers.
- Sputter etching where a high degree of etching anisotropy is required.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.5% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01BO25
- Material: Boron Nitride (BN)
- Size: 2''
- Thickness: 0.250''
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