This boron nitride (BN) sputtering target is a 3'' disc, 0.125'' thick, with 99.5% purity. It serves as the source material for depositing BN thin films by sputtering, a physical vapor deposition (PVD) method in which material is eroded from the target onto a substrate such as a silicon wafer. The process is repeatable and scales from small research projects to production batches on medium to large substrate areas.
Boron nitride is a refractory compound of boron and nitrogen that resists heat and chemical attack. Its hexagonal form (h-BN) is soft, lubricating and electrically insulating yet thermally conductive. The cubic form (c-BN) is the hardest material after diamond and is more chemically stable than diamond against oxygen and ferrous materials at high temperatures.
Sputtered BN layers are in growing demand as cutting-tool, protective, optical and electrically insulating coatings. Sputtering suits this work because it runs at lower coating temperatures and can coat thin layers, sharp edges and complex shapes.
- Deposition of boron nitride thin films on substrates such as silicon wafers by sputtering.
- Hard cubic BN coatings for cutting tools used in dry cutting, high-speed machining and cutting of hard materials.
- Protective coatings that need wear resistance and chemical inertness at high temperatures.
- Optical coatings and electrically insulating layers.
- Research into synthesizing cubic-phase boron nitride coatings.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.5% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01BO26
- Material: Boron Nitride (BN)
- Size: 3''
- Thickness: 0.125''
- Product code: NG0ST01BO26
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