This carbon (C) sputtering target is made of pyrolytic graphite with a purity of 99.999 %. It measures 2'' in size with a thickness of 0.125'' and is supplied as a single piece for sputter deposition systems.
Sputtering builds thin films by eroding material from a target and depositing it onto a substrate, such as a silicon wafer. The method works with many materials and with substrates of varied shape and size. It gives repeatable results and scales from small R&D work up to production batches covering medium to large substrate areas.
Depending on the process settings, chemical reactions may take place on the target surface, in flight, or on the substrate. The number of adjustable parameters makes sputtering a demanding process, but it also gives experienced users fine control over film growth and microstructure.
- Thin film deposition of carbon onto substrates such as silicon wafers.
- Sputter etching where strong etching anisotropy is required and selectivity is not critical.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS), where sputtered atoms are identified by mass spectrometry.
- Scaling deposition processes from research projects to medium and large production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999 % |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST02CA28
- Material: Carbon (C) (Pyrolytic Graphite)
- Size: 2''
- Thickness: 0.125''
- Product code: NG0ST02CA28
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