This carbon (C) sputtering target is made of pyrolytic graphite with a purity of 99.999%. It measures 4'' in size with a thickness of 0.125'' and serves as the source material for depositing carbon thin films by sputtering.
In sputter deposition, material is eroded from the target and deposited onto a substrate such as a silicon wafer. The method works with substrates of many shapes and sizes, gives repeatable results, and can move from small R&D work to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight, or on the substrate. The number of adjustable parameters makes sputtering a complex technique, but it gives experienced users close control over film growth and microstructure.
- Deposition of carbon thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, for example in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity concentrations.
- Research related to space weathering, where sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST02CA32
- Material: Carbon (C) (Pyrolytic Graphite)
- Size: 4''
- Thickness: 0.125''
- Product code: NG0ST02CA32
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