This cobalt (Co) sputtering target has a purity of 99.95%, a size of 3'' and a thickness of 0.250''. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputter deposition is a repeatable technique that scales from small R&D work to production batches covering medium to large substrate areas. Its many process parameters give experienced users close control over film growth and microstructure, and reactions can take place at the target surface, in flight or on the substrate.
Cobalt, element 27, is a hard, lustrous, silver-gray metal. It is one of the three room-temperature ferromagnets and has uniaxial symmetry, which makes it valuable for magnetic and digital recording. Cobalt sputtering targets are used to produce thin films for microelectronic devices such as microprocessors and DRAMs.
- Thin film deposition of cobalt onto substrates such as silicon wafers.
- Production of thin films for microelectronic devices such as microprocessors and DRAMs.
- Magnetic recording layers that exploit cobalt's ferromagnetic, uniaxial properties.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Compositional analysis techniques such as secondary ion mass spectrometry (SIMS).
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01CO06
- Material: Cobalt (Co)
- Size: 3''
- Thickness: 0.250''
- Atomic number: 27
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