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Nanografi

Copper (Cu) Micron Powder

Copper (Cu) Micron Powder
Regular price Rp 4.835.000,00
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This copper (Cu) micron powder from Nanografi consists of spherical particles with a size of 1 µm and a purity of 99.99 % (CAS 7440-50-8). It is intended for laboratories and developers working on conductive formulations, powder-based manufacturing, alloys and coatings.

The spherical shape tends to give more even packing and more predictable flow than irregular particles, while the high purity limits impurities that can influence electrical behaviour, thermal response or process consistency. Particle size also affects surface area, packing, sintering conditions and rheology, so this grade sits between coarser copper powders and copper nanopowder; micron powder is often chosen where lower surface reactivity and easier handling are needed.

In conductive inks, pastes and coatings, final results depend on particle loading, binder chemistry, dispersion quality, curing conditions and control of oxidation. The powder has a face-centred cubic crystal structure, a density of 8.94 g/cm³ and a melting point of 1083 °C.

  • Development of conductive inks and pastes for printed or coated electronic systems.
  • Research on electronic materials such as conductive components, pastes and coatings.
  • Alloy-development studies where particle size, purity and thermal processing are key parameters.
  • Paints, pigments and colorants requiring copper content or a metallic appearance.
  • Thermal-management and heat-transfer formulations based on copper powder.
  • Aerospace-related materials work.

Brand Nanografi
CAS number 7440-50-8
Molecular formula —
Purity 99.99 %
Category —
Pack sizes 25gr, 100gr, 500gr, 1000gr
Physical form Spherical
Storage —
  • Product code: NG01EM1304
  • Particle size: 1 µm
  • Density: 8.94 g/cm³
  • Boiling point: 2595 °C
  • Melting point: 1083 °C
  • Coeff. of expansion @ 20ºC: 16.42 x 10 ⁻⁶
  • Mohs hardness @ 20ºC: 3
  • Electric conductance: 0.593 microhm-1
  • Crystal structure: Cubic, Face Centered

Oxidation control should be considered when formulating with this copper powder, as it influences the performance of inks, pastes and coatings.

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