Copper (Cu) sputtering targets are solid metal plates designed for physical vapor deposition (PVD) processes such as DC magnetron sputtering. During sputtering, energetic ions bombard the target surface and eject copper atoms, which condense onto a substrate to form thin, conductive copper films. As a metallic target in the sputtering target group, it is used where controlled metal thin-film deposition is required in research and manufacturing.
- Quantity: 1 piece
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- Seed and interconnect layers in microelectronics research
- Thin-film electrodes for electronic and optoelectronic device prototyping
- Metallization of substrates for coatings and surface engineering
- Academic studies of thin-film growth and metal deposition
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