Copper (Cu) sputtering targets are solid metallic plates used as the source material in physical vapor deposition (PVD). During sputtering, energetic ions bombard the target surface and eject copper atoms that condense onto a substrate to form thin metallic films. As a transition metal, copper is valued for its electrical and thermal conductivity, making these targets a common choice for conductive thin-film work.
- Quantity: 1 piece
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- Conductive seed and interconnect layers in microelectronics and semiconductor research
- Metallization of flexible electronics, sensors, and printed circuit prototypes
- Thin-film coatings for optical, reflective, and decorative surfaces
- Fundamental studies of thin-film growth, adhesion, and surface properties in university and industrial laboratories
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