Copper (Cu) sputtering targets are solid blocks of copper metal designed for physical vapor deposition (PVD) systems. During sputtering, energetic ions bombard the target surface and eject copper atoms, which condense onto a substrate to form a thin, uniform metallic film. Copper is a widely studied elemental metal, and its targets are a common choice for thin-film research. The target is mounted in a sputtering chamber and is gradually consumed as material is removed from its surface.
- Quantity: 1 piece
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- Seed and conductive layers in thin-film electronics research
- Metallization studies for interconnects and contacts
- Deposition of conductive coatings on glass, polymers, and ceramics
- Fundamental thin-film growth and surface science experiments
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