Copper (Cu) sputtering targets are solid metallic discs or plates made from copper, designed for use in physical vapor deposition (PVD) sputtering systems. Copper is a transition metal valued for its high electrical and thermal conductivity. During sputtering, energetic ions bombard the target surface and eject copper atoms, which then deposit as a thin film onto a substrate.
- 1 piece
For technical specifications, certificate of analysis (CoA), or quotation, please contact AMI Scientific.
- Conductive metal layers and interconnect research in microelectronics
- Thin-film electrode prototyping for solar cell and display research
- Metallic coatings on optical, glass, or polymer substrates
- Fundamental studies of thin-film growth, adhesion, and microstructure
| Brand | — |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | — |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
—
—
