Copper (Cu) sputtering targets are solid metal source plates used in physical vapor deposition (PVD) to deposit thin copper films onto substrates. Copper is a metallic element valued for its electrical and thermal conductivity, and sputtering targets of this material serve as the source for conductive and functional thin-film layers.
- Quantity: 1 piece
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- Conductive thin-film and interconnect layer research
- Thin-film electronics and microelectronics process development
- Functional and decorative coating studies on glass, polymer, or metal substrates
- Sputter deposition process optimization in academic and industrial laboratories
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