This Copper (Cu) sputtering target from Nanografi is a 99.99% pure copper disc measuring 2'' in size and 0.250'' in thickness. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Copper is a reddish, malleable and ductile metal valued for its excellent thermal and electrical conductivity and good corrosion resistance. These properties make copper films a common choice for coating electronic components and instruments, and for electrode layers in thin-film transistors used in large-format, high-resolution TFT-LCD displays.
The target has a particularly fine-grained microstructure, which supports uniform erosion and low susceptibility to particle formation during sputtering. Sputtering itself is a repeatable process that can be scaled from small R&D work to production batches covering medium to large substrate areas, while its many process parameters give experienced users close control over film growth and microstructure.
- Thin-film deposition of copper onto substrates such as silicon wafers.
- Coating of electronic components and electronic instruments.
- Deposition of copper electrode layers in thin-film transistors for TFT-LCD displays.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by sputtering, such as secondary ion mass spectrometry (SIMS).
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST02CO07
- Material: Copper (Cu)
- Size: 2''
- Thickness: 0.250''
- Microstructure: Fine-grained
- Product code: NG0ST02CO07
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