Copper (Cu) sputtering targets are solid metal plates designed for sputter deposition, a physical vapor deposition technique that forms thin copper films on substrates. As a metallic material, copper is valued for its electrical and thermal conductivity, which makes these targets a common choice for thin-film research and development.
- Quantity: 1 piece
For technical specifications, certificates of analysis (CoA), or quotations, please contact AMI Scientific.
- Deposition of conductive copper layers for electronic device prototyping
- Seed layer studies for metallization in semiconductor research
- Functional thin-film coatings for materials science experiments
- Interconnect and wiring process development in microfabrication
| Brand | — |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | — |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
—
—