Copper sputtering targets are solid metallic plates made of copper, belonging to the metal target class used in physical vapor deposition (PVD). During sputtering, energetic ions bombard the target surface and eject copper atoms that condense onto a substrate, forming thin films. Copper is an electrically and thermally conductive metal, so these targets are widely used where conductive coatings are required.
- Quantity: 1 piece
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- Metallization and interconnect layers in microelectronics research
- Conductive electrode and seed layers for thin-film devices
- Thermal and functional coatings on research substrates
- Fundamental studies of metal thin-film growth and adhesion
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