Copper (Cu) sputtering targets are solid metal discs used as source material in physical vapor deposition (PVD) sputtering systems, where ions bombard the target surface and eject copper atoms that condense onto a substrate as a thin film. As a metallic target material, copper is valued for its good electrical and thermal conductivity, which makes it a common choice for conductive thin-film research.
- Quantity: 1 piece
For technical specifications, certificate of analysis (CoA), or a quotation, please contact AMI Scientific.
- Deposition of copper interconnect and seed layers in microelectronics research
- Fabrication of conductive thin films for flexible and printed electronics
- Development of reflective and decorative metallic coatings
- Studies of thin-film growth, adhesion, and corrosion behavior
| Brand | — |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | — |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
—
—
