Copper (Cu) sputtering targets are solid metallic sources used in physical vapor deposition (PVD) to produce thin films. During sputtering, energetic ions bombard the target surface, ejecting copper atoms that condense onto a substrate. As a conductive metal, copper is widely studied for forming electrically conductive layers in thin-film research.
- Quantity: 1 piece
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- Deposition of conductive interconnect and seed layers in microelectronics research
- Metallization of electrodes for thin-film electronic devices
- Development of contact layers for photovoltaic and solar cell research
- Fabrication of functional metal coatings for materials science studies
- Electrode preparation for sensor and electrochemical device research
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