Copper (Cu) sputtering targets are solid metal discs or plates made from copper, a metallic element valued for its high electrical and thermal conductivity. In physical vapor deposition (PVD), the target is bombarded with energetic ions in a vacuum chamber, which ejects copper atoms that condense onto a substrate to form a thin, uniform metallic film. Copper is classified as a non-ferrous transition metal and is widely used as a conductive material in thin-film research.
- Quantity: 1 piece
For technical specifications, certificate of analysis (CoA), or pricing, please contact AMI Scientific.
- Deposition of conductive seed and interconnect layers in semiconductor and microelectronics research
- Fabrication of thin-film electrodes for electronic and optoelectronic device prototypes
- Metallization of substrates for sensors, circuit patterns, and printed electronics studies
- Coating studies for corrosion, reflectivity, and decorative functional layers
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