This copper (Cu) sputtering target from Nanografi is a 4'' disc with a thickness of 0.250'' and a purity of 99.99%. It serves as the source material for depositing thin copper films by sputtering, in which material is eroded from the target and laid down on a substrate such as a silicon wafer.
Copper is a reddish, malleable and ductile metal known for excellent thermal and electrical conductivity and good corrosion resistance. These properties make copper films a common choice for coating electronic components and instruments, and for the electrode layer in thin-film transistors used in large-format, high-resolution TFT-LCD displays, where the copper layer drives individual pixels and influences image quality.
The target has a particularly fine-grained microstructure, which supports uniform erosion and a low tendency toward particle formation during sputtering. Sputter processes are repeatable and can be scaled from small research and development work to production batches covering medium to large substrate areas.
- Thin-film deposition of copper onto substrates such as silicon wafers.
- Coating of electronic components and electronic instruments.
- Electrode layers in thin-film transistors for large-format, high-resolution TFT-LCD television sets.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis such as secondary ion mass spectroscopy (SIMS), where the sputtered atoms are measured by mass spectrometry.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST02CO15
- Material: Copper (Cu)
- Size: 4''
- Thickness: 0.250''
- Microstructure: Fine-grained
- Product code: NG0ST02CO15
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