Copper (Cu) sputtering targets are solid metallic plates used as source material in physical vapor deposition (PVD). During sputtering, energetic ions bombard the target surface, ejecting copper atoms that condense onto a substrate to form a thin, conductive film. Copper is a widely studied metal valued for its high electrical and thermal conductivity.
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- Metallization and interconnect layer research in microelectronics and semiconductor devices
- Seed layer deposition for copper electroplating process studies
- Conductive thin films for electronic and flexible device prototyping
- Contact and electrode layer development in solar cell and optoelectronic research
- Decorative and protective PVD coating studies
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