Copper (Cu) sputtering targets are solid metal plates used as the source material in physical vapor deposition (PVD) sputtering systems. Under vacuum and ion bombardment, copper atoms are ejected from the target and deposited onto a substrate to form thin, conductive copper films. They belong to the metal target category of thin-film deposition materials. Copper is widely studied for its electrical conductivity and is commonly processed as a sputtering target for research-scale and pilot-scale film work.
- Quantity: 1 piece
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- Conductive metallization layers in electronic device prototyping
- Seed layers for electroplating studies in semiconductor research
- Thin-film interconnect development for microelectronics
- Conductive coatings for optical and surface science experiments
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