Copper (Cu) sputtering targets are solid metallic source materials used in physical vapor deposition (PVD), a thin-film coating process. Under vacuum, energetic ions dislodge copper atoms from the target surface, which then condense onto a substrate as a conductive metallic film. Copper belongs to the class of pure metal sputtering targets.
- Quantity: 1 piece
Contact AMI Scientific for technical specifications, certificate of analysis (CoA), or a quotation.
- Deposition of conductive copper seed and interconnect layers in semiconductor and microelectronics research
- Fabrication of thin-film electrodes and conductive traces for sensors and electronic devices
- Development of metallic coatings for optical and reflective thin-film studies
- Materials research on thin-film adhesion, microstructure, and electrical behavior
| Brand | — |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | — |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
—
—