Copper (Cu) sputtering targets are solid metallic source materials used in physical vapor deposition (PVD) processes. Copper is a transition metal valued for its good electrical and thermal conductivity. During sputtering, energetic ions strike the target surface and eject copper atoms, which condense onto a substrate to form thin, uniform films. This product from Nanografi is supplied as a target for deposition systems in research and development.
- Quantity: 1 piece
For technical specifications, CoA, or a quotation, please contact AMI Scientific.
- Conductive thin-film layers in microelectronics and interconnect research
- Seed and barrier layer studies in semiconductor device fabrication
- Reflective and optical coatings in laboratory investigations
- Metallization research for sensors and flexible electronic devices
| Brand | — |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | — |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
—
—