This copper (Cu) sputtering target from Nanografi has a purity of 99.99%, a size of 7'' and a thickness of 0.125''. It serves as the source material for depositing copper thin films onto substrates such as silicon wafers. Sputtering works on many substrate shapes and sizes, gives repeatable results, and can scale from small R&D work up to production batches covering medium to large substrate areas.
Copper is a reddish, malleable and ductile metal. It offers excellent thermal and electrical conductivity and good corrosion resistance, which makes it a key material in the electrical industry and in many alloys. Its high conductivity is why copper layers are increasingly used as electrodes in thin-film transistors for large-format, high-resolution TFT-LCD televisions, where the copper layer drives the individual pixels and so affects image quality.
The target has a particularly fine-grained microstructure. This promotes uniform erosion and keeps particle formation low throughout the sputtering process.
- Sputter deposition of copper thin films onto substrates such as silicon wafers.
- Coating of electronic components and electronic instruments.
- Deposition of electrode layers in thin-film transistors for large-format, high-resolution TFT-LCD displays.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by sputtering, for example in secondary ion mass spectrometry (SIMS), to determine composition and detect trace impurities.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST02CO20
- Material: Copper (Cu)
- Size: 7''
- Thickness: 0.125''
- Microstructure: Fine-grained
- Product code: NG0ST02CO20
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