Copper (Cu) sputtering targets are solid metal plates used as the source material in physical vapor deposition (PVD) processes. During sputtering, energetic ions bombard the target surface and eject copper atoms, which then condense onto a substrate to form a thin metallic film. Copper is a widely studied metal in materials science and thin film research, valued for its electrical and thermal conductivity.
- Quantity: 1 piece
Contact AMI Scientific for technical specifications, CoA, or a quotation.
- Conductive thin film and metallization research
- Interconnect and electrode layer development for microelectronics
- Optical and protective coating studies
- Seed layer preparation for electrodeposition research
| Brand | — |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | — |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
—
—