This copper (Cu) sputtering target from Nanografi is a 7'' target with a thickness of 0.250'' and a purity of 99.999%. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Copper is a reddish, malleable and ductile metal known for its excellent thermal and electrical conductivity and good corrosion resistance. These properties make copper films valuable for electronic components, including electrode layers in thin-film transistors used in large-format, high-resolution TFT-LCD displays, where the copper layer drives individual pixels and influences image quality.
The target has a particularly fine-grained microstructure, which supports uniform erosion and reduces the tendency for particle formation during sputtering. Sputter deposition is a repeatable process that scales from small research projects to production batches on medium to large substrate areas, while its many process parameters give experienced users close control over film growth and microstructure.
- Thin film deposition of copper onto substrates such as silicon wafers.
- Coating of electronic components and electronic instruments.
- Electrode layers in thin-film transistors for large-format, high-resolution TFT-LCD screens.
- Sputter etching where high etching anisotropy is required and selectivity is not critical.
- Material analysis techniques such as secondary ion mass spectrometry (SIMS).
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST02CO21
- Material: Copper (Cu)
- Size: 7''
- Thickness: 0.250''
- Microstructure: Fine-grained
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