Copper sputtering targets are solid discs or plates of copper used as the source material in physical vapor deposition (PVD) sputtering systems. During sputtering, energetic ions bombard the target surface and eject copper atoms, which condense onto a substrate to form thin metallic films. As a conductive metal, copper belongs to the metal sputtering target category used in thin film research and coating development.
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- Deposition of conductive copper seed and interconnect layers in microelectronics research
- Fabrication of thin film electrodes for electronic and sensor devices
- Metallization studies for optical and decorative coatings
- Development of thin film structures for materials science experiments
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