This copper (Cu) sputtering target from Nanografi offers 99.99% purity in an 8'' format with a thickness of 0.125''. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Copper is a reddish, malleable and ductile metal known for excellent thermal and electrical conductivity and good corrosion resistance. These properties make copper films valuable for electronic components and instruments, including the electrode layers of thin-film transistors used in large-format, high-resolution TFT-LCD displays, where the copper layer drives individual pixels.
The target has a particularly fine-grained microstructure, which supports uniform erosion and a low tendency toward particle formation during sputtering. Sputter processes are repeatable and can scale from small research projects to production batches covering medium to large substrate areas, while their many adjustable parameters give close control over film growth and microstructure.
- Thin-film deposition of copper onto substrates such as silicon wafers.
- Coating of electronic components and electronic instruments.
- Electrode layers in thin-film transistors for large-format, high-resolution TFT-LCD screens.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by sputtering, such as secondary ion mass spectroscopy (SIMS).
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST02CO23
- Material: Copper (Cu)
- Size: 8''
- Thickness: 0.125''
- Microstructure: Fine-grained
- Product code: NG0ST02CO23
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